基本解释：晶片/小晶片
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Double-sided polishing process is a precise machining method for silicon wafers.晶片在双面抛光加工过程中具有多向运动、受力复杂、表面材料微细去除的特征,晶片的运动和受力是影响双面抛光加工质量的主要因素。
SiC platelets/C preform was infiltrated with liquid silicon to prepare reaction bonded silicon carbide(RBSC) materials.以液Si浸渗SiC片晶和C的坯体制备了SiC片晶增韧反应烧结SiC陶瓷材料,讨论了SiC片晶的掺加分数及烧结温度对材料显微结构和力学性能的影响,并比较了所得材料与传统反应烧结材料的力学性能。
Advances in the development of ceramies toughened with whiskers, particles or platelets are reviewed with primary focus on toughening mechanism by crack bridging process-es (e.讨论了用晶须、颗粒或片晶增韧陶瓷在断裂韧性和强度上的发展。
CdSe Detector Wafer Surface Treatment and Passivation Study;CdSe探测器晶片表面处理和钝化研究
Free-pyro black LiNbO_3 and LiTaO_3 wafers were prepared successfully by chemical reduction at (700 °C) and 450 °C respectively under a mixed atmosphere of CO_2 and H_2.采用化学还原工艺,在CO2与H2混合气氛下对LN和LT晶片分别进行700°C和450°C退火处理,成功地制备了LN和LT黑色晶片。
The wafer edge grinding technique of the semiconductor technology was discussed,and the feature was analyzed.对半导体工艺中晶片的边缘磨削技术进行了论述,分析了晶片边缘磨削技术的特点,在此基础上,提出了一种高效、可靠的晶片边缘磨削方法。
The microstructure and mechanical properties of in situ A12O3 platelet/Ce-TZP composites were studied.研究了原位生长Ａｌ２Ｏ３片晶／Ｃｅ－ＴＺＰ复合材料的显微结构与力学性能。
form cobalt hydroxides were synthesized through a controlled crystallization process under the certain mixing intensity, Co 2+ concentration, pH value and the protect of the inert gas and the products was fine platelet powder with high purity and high crystallinity.通过控制结晶法，在一定的搅拌强度、一定的Ｃｏ２＋ 浓度、一定的ｐＨ值和惰性气体保护的条件下合成出高纯度和高结晶度的β－Ｃｏ（ＯＨ）２ 的片晶细粉。
Ultra precision-machining technology for crystal wafers;晶片材料的超精密加工技术现状
The article directly introduced crystal wafer processing and other main parameters through testing diagrams,meanwhile four inch LiNbO3 wafer s reaching level of Ningxia Orient Tantalum Industry.通过检测图片,直观地介绍了衡量晶片加工水平各主要参数的意义;同时,介绍了宁夏东方钽业4英寸LN(LiNbO3)晶片研发的进展,并和目前国外4英寸LN晶片加工水平进行了对比。
Monocrystalline germanium slicesGB/T15713-1995锗单晶片
multicrystal phased array scanning相控阵多晶片电子扫描
strontium barium niobate pyroelectric crystal plate铌酸锶钡热电晶片材料
Others tried stacking conventional 2-D chips on top of one another.另外有人试著把二维晶片一片片堆叠起来。
To smooth the surface of a wafer or semiconductor crystal.使晶片或半导体晶体的表面光滑的过程。
Hydrothermal Synthesis of the Mn_xZn_(1-x)O Crystal and the Crystal Sheet of Nano Boehmite;水热法合成Mn_xZn_（1-x）O晶体和纳米薄水铝石晶片
EFFECT OF TWIN LAMELLAR THICKNESS ON THE FATIGUE PROPERTIES OF NANO-TWINNED Cu孪晶片层厚度对纳米孪晶Cu疲劳性能的影响
The CBFS series is a3 terminal EMI Suppressor Filter based on multilayer chip capacitor technology.CBF系列的晶片系以积层晶片电容科技为基础之三端子滤波器.
Research on Fabrication Technology of Bumps for Flip Chip用于倒装芯片的晶片凸点制作工艺研究
Specification for establishing a wafer coordinate systemGB/T16596-1996确定晶片坐标系规范
Mechanical Test Wafer- A silicon wafer used for testing purposes.机械测试晶圆片-用于测试的晶圆片。
plate form of wax crystals石蜡结晶的片状结构
polycrystalline diamond compact bit聚晶金刚石复合片钻头
Molten salt synthesis of platelet NaNbO_3 crystals熔盐法合成片状NaNbO_3晶体
" Indium antimonide polycrystal, single crystals and as-cut slices"GB/T11072-1989锑化铟多晶、单晶及切割片
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.加工测试晶圆片-用于区域清洁过程中的晶圆片。
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
Monocrystalline silicon ascut slices and lapped slicesGB/T12965-1996硅单晶切割片和研磨片
