字典

die bonding

die bonding


基本解释:晶片接合,晶片焊接

网络释义


die bonding

1)die bonding,晶片接合,晶片焊接2)die obnder,晶片接合机3)semiconductor chip bonding,半导体晶片焊接4)direct wafer bonding,晶片直接键合5)multiple bonding,多数个晶片接合6)eutectic die bonder,共晶芯片焊接装置

汉语字典(www.zxzidian.com)行业英语频道为您提供晶片接合,晶片焊接的英文是die bonding,die bonding的意思,die bonding是什么意思等内容,如果您正在查询die bonding缩写的全称、翻译、解释等信息,本页内容可供您参考

用法和例句


Over coming lattice and orientation mismatch, direct wafer bonding allows fabricating of structures and devices which can get through hetero-epitaxial growth.晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。JLz汉语字典

Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。JLz汉语字典

The application of wafer bonding technology in long? wave vertical cavity devices is given.最后介绍了晶片键合技术在长波长垂直腔型器件研制中的应用。JLz汉语字典

direct-coupled transistor amplifier直接耦合晶体管放大器JLz汉语字典

DCTL [Direct-Coupled Transistor Logic]直接耦合电晶体逻辑JLz汉语字典

direct-coupled transistor logic直接耦合晶体管逻辑JLz汉语字典

Research of GaAs/InP Wafer Bonding Technology;GaAs/InP晶片键合技术的研究JLz汉语字典

Investigation of Low-Temperature Wafer Bonding and Long-Wavelength Tunable Integrated Optical Demultiplexing and Receiving Device for WDM Application;低温晶片键合技术及长波长可调谐WDM解复用光接收集成器件的研究JLz汉语字典

Bonding Interface- The area where the bonding of two wafers occurs.绑定面-两个晶圆片结合的接触区。JLz汉语字典

Researches on Electrical and Mechanical Characteristics of Low Temperature InP/Si Wafer Bonding;InP/Si低温晶片键合的电特性和力学特性的研究JLz汉语字典

Theory Analysis and Experiment Research of Low Temperature Si/InP Wafer Bonding Technology;Si/InP晶片低温键合技术的理论分析和实验研究JLz汉语字典

Experiments of Low Temperature Wafer Bonding and Analysis on Relevant Dynamics;低温晶片键合的实验和动力学特性研究JLz汉语字典

direct-coupled transistor logic circuit直接耦合晶体管逻辑电路JLz汉语字典

DCUTL (Direct-Coupled Unipolar Transistor Logic)直接耦合单极晶体管逻辑JLz汉语字典

High Brightness ODR LED Based on Au/Au Wafer Bonding基于Au/Au直接键合的高亮度ODRLEDJLz汉语字典

The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method./玻璃激光键合中,温度场的分布是影响晶片能否键合的关键因素。JLz汉语字典

The Simulation for Dynamics of Ⅲ-V Material Epitaxy Growth and the Experiment of Wafer Bonding;Ⅲ-V族材料外延生长的动力学模拟仿真及半导体晶片键合的实验JLz汉语字典

In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4).在这个过程,标准印刷技术用来把膏直接印刷到晶片上。JLz汉语字典

Theoretical Study on Spin-spin Coupling Constants of Directly Bonded Atoms;直接键连原子间核自旋偶合常数的理论研究JLz汉语字典