基本解释：晶圆後端测试
汉语字典(www.zxzidian.com)行业英语频道为您提供晶圆後端测试的英文是final wafer test，final wafer test的意思，final wafer test是什么意思等内容，如果您正在查询final wafer test缩写的全称、翻译、解释等信息，本页内容可供您参考
Wafer Probe Acquires a New Importance in Testing;晶圆测试探针新的测试价值
The RF Wafer Test Technology with SoC Tester基于SoC测试系统的RF圆晶片测试技术
Mechanical Test Wafer- A silicon wafer used for testing purposes.机械测试晶圆片-用于测试的晶圆片。
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.加工测试晶圆片-用于区域清洁过程中的晶圆片。
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
Particle Counting- Wafers that are used to test tools for particle contamination.颗粒计算-用来测试晶圆片颗粒污染的测试工具。
Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.测试晶圆片-影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。
Premium Wafer- A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.测试晶圆片-影印过程中用于颗粒计算、量溶解度和检测金属污染的晶圆片。
Profilometer - A tool that is used for measuring surface topography.表面形貌剂-一种用来测量晶圆片表面形貌的工具。
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
Design of the transistor characteristic test system based on 51 MCU基于51单片机的晶体管特性测试系统的设计
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
Notch- An indent on the edge of a wafer used for orientation purposes.凹槽-晶圆片边缘上用于晶向定位的小凹槽。
Bonding Interface- The area where the bonding of two wafers occurs.绑定面-两个晶圆片结合的接触区。
Primary Orientation Flat- The longest flat found on the wafer.主定位边-晶圆片上最长的定位边。
Slip- A defect pattern of small ridges found on the surface of the wafer.划伤-晶圆片表面上的小皱造成的缺陷。
Mound- A raised defect on the surface of a wafer measuring more than0.25 mm.堆垛-晶圆片表面超过0.25毫米的缺陷。
Pit- A non-removable imperfection found on the surface of a wafer.深坑-一种晶圆片表面无法消除的缺陷。
