基本解释：刻版黄铜(一种含铅黄铜)
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Prediction of Superplastic Properties of Lead Brass Based on BP Neural Network;基于BP神经网络的铅黄铜超塑性能预测
Effects of Modification on As-cast Microstructure and Properties as well as Solidification Mode of Lead Brass in Permanent Mold;变质处理对铅黄铜铸态组织及凝固方式的影响
The BP network predicting models of lead brass among superplastic tension temperature,initial strain rate and elongation,flow stress were established using the Levenberg-Marquardt method.借助Levenberg-Marquardt算法,建立了铅黄铜超塑性拉伸温度、初始应变速率与延伸率、流动应力之间的BP网络预测模型,分析了拉伸温度、初始应变速率与延伸率和流动应力之间的关系,得出了铅黄铜最佳的超塑性条件,并以此为依据,进行了铜合金轴承保持架的超塑性成形试验。
The Application of Orthogonal Experiment to the Composition Design of Lead-free Brass正交试验法在无铅黄铜成分设计中的应用
The Research and Development of the Environmental Friendly Unleaded Free-cutting Brass and Its Property Investigation;环境友好无铅易切削黄铜的开发及性能研究
Leaded brass strips for special purposeGB/T11089-1989专用铅黄铜带
Leaded brass bar for making needle seat of syringeGB/T4428-1984铅黄铜针座棒
Brass, copper, stainless steel, bismuth, and lead are all suitable.黄铜、铜、不锈钢、铋及铅都是适合的。
What bronze uses is not brass,but red copper and the alloy of plumbum and stannic.青铜所用的不是黄铜，是红铜和铅、锡的合金。
373 Copper, zinc, lead, aluminium, bronze and brass are nonferrous metals or alloys.铜、锌、铅、铝、青铜和黄铜都是有色金属或合金。
HPb63-0.1 leaded brass tube for air valve mouth applicationsGB/T8010-1987气门嘴用HPb63-0.1铅黄铜管
Study of Continuous Extrusion for Brass HPb59-1铅黄铜HPb59-1连续挤压工艺的研究
Hot Extrusion Process of HPb59-1 Flange with Capsule Method包套法热挤压铅黄铜HPb59-1法兰工艺
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;铜单晶体/无铅焊料的界面组织与性能
Effect of Cu addition on Sn-9Zn lead-free solder properties添加铜对Sn-9Zn无铅钎料性能的影响
Study on Elements Cu、 Zn in Astragalus and Pb、Cd in Ash Bark with Single-sweep Oscillopolarography示波极谱法测定黄芪中铜、锌和秦皮中铅、镉
Effect of New Type Copper Alloys Refinement Additive on Modification of Cast Lead Brass新型铜合金细化添加剂对铸造铅黄铜变质处理效果的影响
Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone;微结构铜基底上无铅SnAgCu焊料润湿的形貌研究
Effect of Cerium on Property and Microstructure for SnAgCu Lead Free Solder;稀土铈对锡银铜无铅钎料组织性能的影响
